CMM interconnect system is a 2mm pitch connector with proven high reliability under the most extreme environmental conditions of use, vibration & shock severity, high temperature (250°C for 1000 hours exceding the 85°C per the MIL), humidity, salt spray, corrosion and high altitude (70,000 ft). This system has fulfilled the most rigorous requirements under MIL-DTL55302F qualification test routine and EIA test procedures.

This Board to Board, Board to Wire and Wire to Wire interconnect system benefits from the option of a mixed layout, giving the designer a choice of high frequency (up to 11 GHz), high power (up to 30 Amps), and low frequency (3A) contact configurations. 20 million standard arrangements are available in a short lead-time!

Termination styles are available for through board solder, surface mount and press fit. An integral stainless steel locking mechanism or spring latching system offers security of interconnection, whilst a high temperature insulator allows infrared on vapor phase soldering (+260°C). Along with a small, space saving 2mm footprint, (enables up to 60% space saving over conventional 2.54mm systems), the system also features a high reliability contact design, which can be used under extreme vibration and environmental conditions.