Adhesives & Resins Overview:

• General purpose adhesives. Encapsulant\potting adhesives – epoxy, polyurethane or silicone.

• Circuit assembly adhesives - Electrically conductive or thermally conductive adhesives.

• Dielectric adhesives.

• Surface mount adhesives.

• Chip on board encapsulants, glob tops, underfills or dam-and-fill encapsulants.

• Thermal management materials.

Bonding & Structural Adhesives: Available in single part or two part mix, room temp or heat cure versions. Materials with strong mechanical strength, high operating temperature, chemical resistance and low coefficient thermal expansion.

Alternative To Solder Paste: Fast curing adhesives designed to replace solder, meeting electrical, thermal and mechanical requirements of solder. Available in room temp or heat cure, single part or two part mix or stencil & screening printing versions.

Die-attach: Industry standard die-attach epoxies. With high thermal and electrical conductivity properties. Features with high shear & bond strength and single part material.

Film Adhesives: For grounding, substrate attach, die-attach, component attach and staking requirements, thermally or electrically conductive film adhesives.

Down-packing: Capabilities to provide material packed in twin-packs, barrels or HEMKIT\SEMKIT cartridges subject to material formation.

Potting Compounds: Potting compounds are used to fill large voids, protect components against shock and vibration, and provide resistance against chemicals, moisture and low and high temperatures. These compounds come in epoxy, polyurethane and silicone forms; each with vastly differing properties to tailor to your application.