Thermally Conductive Gap Filler Pads: Soft, thermally conductive. Use where heat needs to be conducted over a large gap between hot components and cold surfaces. Choice of grades and thickness.

Dispensable Thermal Gels: Pre-cured, single component compounds. Low stress. Variable width gaps. Dispensable. No mixing or curing.

Phase Change Materials (Non-Silicone): Solid at room temperature for easy application. Materials soften as it reaches component temperature.

Electrically non-conductive. Choice of thickness and grades.

Thermally Conductive Attachment Tapes: Thermally conductive tapes on acrylic or silicone pressure sensitive adhesive base.

Thermal Compounds (Potting & Underfills): Thermally conductive silicone. Dispensable. Heat transfer with no compressive force. Complex geometry possible.

Thermal Greases: Can be screened, stencilled or dispensed. Silicone based. Thermally Conductive Dielectric Insulator Pads: An alternative to greased mica, these are typically used between discrete power devices and heat sinks.

Low Profile Heat Spreaders: Low cost, effective solution for cooling IC’s in areas of restricted space. Copper foil with pressure sensitive adhesive backing for easy installation.

Super Thermally Conductive Pads: Our HEM Super Thermally Conductive Pads offer high thermal conductivity values (14-16W/m-K), conformability (Shore A 20 – 50) and an array of thicknesses (0.2mm to 2.0mm); ensuring the highest levels of thermal coupling tailored for any application.